A10108-02 - Laird Technologies - Thermal Materials - Online electronic components supplier

Product overview

Part Number: A10108-02

Manufacturer: Laird Technologies - Thermal Materials

Product Category: Thermal - Pads, Sheets

Description: THERM PAD 203.2MMX203.2MM W/ADH

Documents & Media

Datasheets: A10108-02

Description

THERM PAD 203.2MMX203.2MM W/ADH

Price & Procurement

Associated Product

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

You May Also Be Interested In

QYX2A272KTP R82EC3220Z370J ECH-U1C823GX5 ECQ-E2103KF QYX2A182JTP QYX2A122JTP ECQ-E2473KF QYX1H562JTP R82EC1680Z350J QYX1H392JTP QYX1H272JTP FCA1206C224M-H1 LDEEC2470JA5N00 B32529C0392J000 B32529C1102J000 B32529C1103J000 B32529C1104J000 B32529C0333J000 B32529C0822J000 QYX1H183KTP