HSB08-212106 - CUI Devices - Online electronic components supplier

Product overview

Part Number: HSB08-212106

Manufacturer: CUI Devices

Product Category: Thermal - Heat Sinks

Description: HEAT SINK, BGA, 21 X 21 X 6 MM

Documents & Media

Datasheets: HSB08-212106

Description

HEAT SINK, BGA, 21 X 21 X 6 MM

Price & Procurement

Associated Product

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XILINX

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MT40A512M16LY-062E IT:E

MICRON

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LTM4630IV#PBF

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DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
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XILINX
VL53L1CBV0FY/1

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CONN HEADER R/A 16POS 2.54MM

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