HSB19-272718 - CUI Devices - Online electronic components supplier

Product overview

Part Number: HSB19-272718

Manufacturer: CUI Devices

Product Category: Thermal - Heat Sinks

Description: HEAT SINK, BGA, 27 X 27 X 18 MM

Documents & Media

Datasheets: HSB19-272718

Description

HEAT SINK, BGA, 27 X 27 X 18 MM

Price & Procurement

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