HSB05-171711 - CUI Devices - Online electronic components supplier

Product overview

Part Number: HSB05-171711

Manufacturer: CUI Devices

Product Category: Thermal - Heat Sinks

Description: HEAT SINK, BGA, 17 X 17 X 11.5 M

Documents & Media

Datasheets: HSB05-171711

Description

HEAT SINK, BGA, 17 X 17 X 11.5 M

Price & Procurement

Associated Product

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

You May Also Be Interested In

1-1472973-4 2917405 LIBT2010 CDB-115A-5-20M HRV41AE PM4HM-H-AC240VS 9-1423159-8 KSDR40A0 LIBT2E00 CDB-24A-2-1M HRV41SE PM4HM-H-AC240VW TD230-5002P KSDR42A4 LIBT2E10 CDB-125D-2-1M CDA-38-70012 HRV42SE PM4HM-H-DC12V 7-1472969-1