Product overview
- Part Number
- HSB12-272706
- Manufacturer
- CUI Devices
- Product Category
- Thermal - Heat Sinks
- Description
- HEAT SINK, BGA, 27 X 27 X 6 MM
Documents & Media
- Datasheets
- HSB12-272706
Description
HEAT SINK, BGA, 27 X 27 X 6 MM
Price & Procurement
Associated Product
You May Also Be Interested In
KNP400JR-73-2R4
RN55D6193FRE6
FRN2JA1K00
CMF553K6000FHEA
RC1/4223MTD
MFP50SBRE52-6K81
MFP50SBRE52-19K3
RN55D5561FRE6
KNP400JR-73-2R7
RN55D6183FB14
FKN3WSJR-73-100R
CMF55475R00FHEA
RC1/46R8MTD
MFP50SBRE52-6K98
MFP50SBRE52-19K6
RN55D5600FB14
KNP400JR-73-30R
RN55D6043FRE6
FKN3WSJR-73-10R
CMF55681R00FHEA