BDN11-3CB/A01 - CTS Thermal Management Products - Online electronic components supplier

Product overview

Part Number: BDN11-3CB/A01

Manufacturer: CTS Thermal Management Products

Product Category: Thermal - Heat Sinks

Description: HEATSINK CPU W/ADHESIVE 1.11"SQ

Documents & Media

Datasheets: BDN11-3CB/A01

Description

HEATSINK CPU W/ADHESIVE 1.11"SQ

Price & Procurement

Associated Product

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

You May Also Be Interested In

AT0805CRD077K15L RN73H2ATTD1870C50 CPF0805B57R6E RN73H2ATTD1104B25 CSRN2010FTR220 RN73H2ATTD1240C25 CPF0805B976KE AT0805CRD07887RL AT0805CRD077K32L RN73H2ATTD2491C25 CPF0805B59RE RN73H2ATTD1070B50 CSRN2010FTR240 RN73H2ATTD1230B50 UCR006YVPFLR120 AT0805CRD0788K7L AT0805CRD077K5L RN73H2ATTD17R6C50 CPF0805B60R4E RN73H2ATTD1260C50