HSB01-080808 - CUI Devices - Online electronic components supplier

Product overview

Part Number: HSB01-080808

Manufacturer: CUI Devices

Product Category: Thermal - Heat Sinks

Description: HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Documents & Media

Datasheets: HSB01-080808

Description

HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

Price & Procurement

Associated Product

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DC DC CNVRTR 0.6-1.8V 0.6-1.8V
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