TC1-10G - Chip Quik Inc. - Online electronic components supplier

Product overview

Part Number: TC1-10G

Manufacturer: Chip Quik Inc.

Product Category: Thermal - Adhesives, Epoxies, Greases, Pastes

Description: HEAT SINK COMPOUND - HIGH DENSIT

Documents & Media

Datasheets: TC1-10G

Description

HEAT SINK COMPOUND - HIGH DENSIT

Price & Procurement

Associated Product

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

You May Also Be Interested In

D38999/24WH2PBL D38999/26WJ61SNL D38999/20WF11BCL D38999/26ZE6PAL D38999/26FG35PNL M83723/72R2041N-LC D38999/20MJ11SNL 8D0-19W28AC D38999/24FH2PBL D38999/26WH53SEL D38999/20WJ11AN MS27467T21B35PL D38999/26WF11PNL D38999/24WA35HBL D38999/24WG39PCL D38999/20WF35AC D38999/26ZH32SBL D38999/24WA3PEL D38999/26SA35SA D38999/24WJ11PNL