HSB10-232306 - CUI Devices

产品概览

产品型号: HSB10-232306

制造商: CUI Devices

产品类别: Thermal - Heat Sinks

产品描述: HEAT SINK, BGA, 23 X 23 X 6 MM

文档与媒体

数据列表: HSB10-232306

产品描述

HEAT SINK, BGA, 23 X 23 X 6 MM

采购与价格

推荐产品

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

您可能在找

8D025Z08PB737 8D025X08SN747 8D025S11PB 8D025X46SC 8D021X59SA 8D025W08PD747 8D0C17J82SE284 8D021F48SN 8D025Z08PB747 8D025X11PA 8D025S11PC 8D025X46SC251 8D021X59SB 8D025W08PE 8D0C17J82SE308 8D021F59PA 8D025Z08PC 8D025X11PB 8D025S11PD 8D025X46SC737