HSE-B18381-0396H - CUI Devices - WESAN

HSE-B18381-0396H

产品概览

产品型号: HSE-B18381-0396H

制造商: CUI Devices

产品类别: Thermal - Heat Sinks

产品描述: HEAT SINK, EXTRUSION, TO-218, 38

文档与媒体

数据列表: HSE-B18381-0396H

产品描述

HEAT SINK, EXTRUSION, TO-218, 38

采购与价格

推荐产品

XC7K325T-2FFG900I

XILINX

DC:21+ IC FPGA 500 I/O 900FCBGA
MT40A512M16LY-062E IT:E

MICRON

IC DRAM 8GBIT PARALLEL 96FBGA
LTM4630IV#PBF

Analog Devices Inc.

DC DC CNVRTR 0.6-1.8V 0.6-1.8V
8543BGILF

Renesas Electronics America Inc

IC CLK BUFFER 2:4 650MHZ 20TSSOP
TST-108-05-S-D-RA

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM
MKV10Z128VLH7

XILINX
VL53L1CBV0FY/1

MICRON
PCT2075D

Analog Devices Inc.
MP6550GG-P

Renesas Electronics America Inc

1.8V TO 22V, 2A, H-BRIDGE MOTOR
MSP430G2433IRHB32R

Samtec Inc.

CONN HEADER R/A 16POS 2.54MM

您可能在找

YB25WSKW01-5D24-JB YB15WCKG01-5F24-JF UB15NBKW01N A22NN-BPM-NGA-G202-NN IPR3SAD6L0G YB16CKW01-5F-JB MB2185SB1W01-5C-A YB25WSKW01-5D24-JD D16EER13GGRNGRN YB15WCKG03-BB A22NN-BPM-NRA-G101-NN IPC3SAD6L0G YB15SKG01-5F-JB YB15WCKW01-1C02-JC YB25WSKW01-5F24-JF D16EET13GGRNGRN YB15WCKG03-CB A22NN-BPM-NRA-G102-NN IPC3SAD7/1L0G YB16RKW01-5C-JC